Introduction

The International Electronics Manufacturing Initiative (iNEMI) is conducting this survey to understand the status of stakeholders, materials, applications, standards and test methods for high-volume deployment of optical adhesives for optoelectronics applications, particularly for silicon photonics and co-packaged optics. This work is part of the FUTUR-IC initiative led by MIT and funded by the National Science Foundation (NSF). The FUTUR-IC alliance has 26 global collaborators including external collaborators such as iNEMI, Tyndall National Institute, SEMI, Hewlett Packard Enterprise, Intel, and the Rochester Institute of Technology.

One of the projects in this initiative aims to accelerate the development and adoption of economically and environmentally sustainable optical adhesive materials. Your participation in this survey (estimated time 10 - 20 mins) will contribute immensely to the progress of this goal.

For more information about FUTUR-IC, please visit https://www.ikim.mit.edu/technology and/or watch the following introductory video.
Confidentiality

Survey participants have the option to identify themselves or remain anonymous. We respect the information you provide, and any information shared in the survey report will be aggregated and not attributed to specific companies or individuals. Only INEMI and FUTUR-IC alliance participants will have access to your responses and/or your contact information (if you choose to provide it).

All respondents who provide their contact information (below) will be invited to a webinar summarizing the survey results in February 2025.

The deadline for submitting the survey is January 20, 2025. Thank you in advance for taking the time to contribute to this survey.

Survey Notes
  • If you need to go back to a previous question, use the "prev" button at the bottom of the survey page instead of the back arrow in your browser.
  • Any question marked with an asterisk (*) must be answered; other questions can be skipped if necessary.

Contact

If you have any questions about the survey, would like to join the FUTUR-IC alliance or explore a project around the topic, please contact Girish Wable (gwable@inemi.org).

Question Title

* 1. If you would like to be invited to the webinar to review results of this survey, please provide your contact information.

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