Question Title

* 1. What concern exists when mixing tin-lead and tin-bismuth solders?

Question Title

* 2. How much copper is in SAC305 solder?

Question Title

* 3. Which temperature is closest to SAC305’s melting point?

Question Title

* 4. What does OSP stand for?

Question Title

* 5. What does ENIG stand for?

Question Title

* 6. In solder paste, what is response to pause?

Question Title

* 7. What is more typical of a solder paste powder diameter:

Question Title

* 8. The formula for aspect ratio (AR) for a stencil aperture is: d/t, where t is the stencil thickness and d is the line width. Assuming the stencil is 5 mils thick, what is the finest line that can be reliably printed? A rule of thumb is the AR should be ≥1.5.

Question Title

* 9. Assume that component placement is the “gate” in an SMT assembly process line, which has one chip shooter and one flexible placement machine. The chip shooter takes 60 seconds to place its components. While the flexible placer takes 45 seconds. There are some chips being placed by the flexible placer. To improve productivity, what should be done?

Question Title

* 10. What is a fiducial on a printed wiring board?

Question Title

* 11. If you would like to participate to win a $25 digital gift card, please leave your contact information.

Indium Corporation reserves the right to modify or cancel this promotion, due to system error, fraud, or other unforeseen problems. If you have any questions, please email us at askus@indium.com.

T